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Manufacturer for Custom Pcb - EMS solutions for Printed Circuit Board – Mineiwing

Your EMS partner for the JDM, OEM, and ODM projects.

Manufacturer for Custom Pcb - EMS solutions for Printed Circuit Board – Mineiwing


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Our rewards are reduce selling prices,dynamic revenue team,specialized QC,sturdy factories,superior quality services for Custom Printed Circuit Boards , Printed Circuit Board Making , Ipc Standards For Pcb Assembly , We warmly welcome small business companions from all walks of lifestyle, hope to establish friendly and cooperative business make contact with with you and attain a win-win objective.
Manufacturer for Custom Pcb - EMS solutions for Printed Circuit Board – Mineiwing Detail:

Description

Equipped with SPI, AOI, and X-ray device for 20 SMT lines, 8 DIP, and test lines, we offer an advanced service that includes a wide range of assembly techniques and produce the multi-layers PCBA, flexible PCBA. Our professional laboratory has ROHS, drop, ESD, and high & low temperature testing devices. All of the products are conveyed by strict quality control. Using the advanced MES system for manufacturing management under IAF 16949 standard, we handle the production effectively and securely.
By combining the resources and the engineers, we can also offer the program solutions, from the IC program development and software to electric circuit design. With experience in developing projects in healthcare and customer electronics, we can take over your ideas and bring the actual product to life. By developing the software, program, and the board itself, we can manage the whole manufacturing process for the board, as well as the final products. Thanks to our PCB factory and the engineers, it provides us with competitive advantages compared to the ordinary factory. Based on the product design & development team, the established manufacturing method of different quantities, and effective communication between the supply chain, we are confident of face the challenges and get the work done.

PCBA Capability

Automatic equipment

Description

Laser marking machine PCB500

Marking range: 400*400mm
Speed: ≤7000mm/S
Maximum power: 120W
Q-switching, Duty Ratio: 0-25KHZ; 0-60%

Printing machine DSP-1008

PCB size: MAX:400*34mm MIN:50*50mm T:0.2~6.0mm
Stencil size: MAX:737*737mm
MIN:420*520mm
Scraper pressure: 0.5~10Kgf/cm2
Cleaning method: Dry cleaning, wet cleaning, vacuum cleaning (programmable)
Printing speed: 6~200mm/sec
Printing accuracy: ±0.025mm

SPI

Measuring principle: 3D White Light PSLM PMP
Measurement item: Solder paste volume, area, height, XY offset, shape
Lens resolution: 18um
Precision: XY resolution: 1um;
High speed: 0.37um
View dimension: 40*40mm
FOV speed: 0.45s/FOV

High speed SMT machine SM471

PCB size: MAX:460*250mm MIN:50*40mm  T:0.38~4.2mm
Number of mounting shafts: 10 spindles x 2 cantilevers
Component size: Chip 0402(01005 inch)  ~ □14mm(H12mm) IC,Connector(lead pitch 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm)
Mounting accuracy: chip ±50um@3ó/chip, QFP ±30um@3ó/chip
Mounting speed: 75000 CPH

High speed SMT machine SM482

PCB size: MAX:460*400mm MIN:50*40mm  T:0.38~4.2mm
Number of mounting shafts: 10 spindles x 1 cantilever
Component size: 0402(01005 inch)  ~ □16mm IC,Connector(lead pitch 0.4mm),※BGA,CSP(Tin ball spacing 0.4mm)
Mounting accuracy: ±50μm@μ+3σ (according to standard chip’s size)
Mounting speed: 28000 CPH

HELLER MARK III Nitrogen reflux furnace

Zone: 9 heating zones, 2 cooling zones
Heat source: Hot air convection
Temperature control precision: ±1℃
Thermal compensation capacity: ±2℃
Orbital speed: 180—1800mm/min
Track width range: 50—460mm

AOI ALD-7727D

Measuring principle: The HD camera obtains the reflection state of each part of the three-color light irradiating on the PCB board, and judges it by matching the image or logical operation of gray and RGB values of each pixel point
Measurement item: Solder paste printing defects, parts defects, solder joint defects
Lens resolution: 10um
Precision: XY resolution: ≤8um

3D X-RAY AX8200MAX

Maximum detection size: 235mm*385mm
Maximum power: 8W
Maximum voltage: 90KV/100KV
Focus size: 5μm
Safety (radiation dose): <1uSv/h

Wave soldering DS-250

PCB width: 50-250mm
PCB transmission height: 750 ± 20 mm
Transmission speed: 0-2000mm
Length of preheating zone: 0.8M
Number of preheating zone: 2
Wave number: Dual wave

Board splitter machine

Working range: MAX:285*340mm  MIN:50*50mm
Cutting precision: ±0.10mm
Cutting speed: 0~100mm/S
Speed of rotation of spindle: MAX:40000rpm

Technology Capability

Number

Item

Great capability

1

base material Normal Tg FR4, High Tg FR4, PTFE, Rogers, Low Dk/Df etc.

2

Solder mask color green, red, blue, white, yellow, purple,black

3

Legend color white, yellow, black, red

4

Surface treatment type ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver

5

Max. layer-up(L) 50

6

Max. unit size (mm) 620*813 (24″*32″)

7

Max. working panel size (mm) 620*900 (24″x35.4″)

8

Max. board thickness (mm) 12

9

Min. board thickness(mm) 0.3

10

Board thickness tolerance (mm) T<1.0 mm: +/-0.10mm ;  T≥1.00mm: +/-10%

11

Registration tolerance (mm) +/-0.10

12

Min. mechanical drilling hole diameter (mm) 0.15

13

Min. laser drilling hole diameter(mm) 0.075

14

Max. aspect(through hole) 15:1
Max. aspect(micro-via) 1.3:1

15

Min. hole edge to copper space(mm) L≤10, 0.15;L=12-22,0.175;L=24-34, 0.2;L=36-44, 0.25;L>44, 0.3

16

Min. innerlay clearance(mm) 0.15

17

Min. hole edge to hole edge space(mm) 0.28

18

Min. hole edge to profile line space(mm) 0.2

19

Min. innerlay copper to profile line sapce (mm) 0.2

20

Registration tolerace between holes (mm) ±0.05

21

Max. finished copper thickness(um) Outer Layer: 420   (12oz)
Inner Layer: 210   (6oz)

22

Min. trace width (mm) 0.075 (3mil)

23

Min. trace space (mm) 0.075 (3mil)

24

Solder mask thickness (um) line corner :  >8 (0.3mil)
upon copper: >10 (0.4mil)

25

ENIG golden thickness (um) 0.025-0.125

26

ENIG nickle thickness (um) 3-9

27

Sterling silver thickness (um) 0.15-0.75

28

Min. HAL tin thickness (um) 0.75

29

Immersion tin thickness (um) 0.8-1.2

30

Hard-thick gold plating gold thickness  (um) 1.27-2.0

31

golden finger plating gold thickness (um) 0.025-1.51

32

golden finger plating nickle thickness(um) 3-15

33

flash gold plating gold thickness (um) 0,025-0.05

34

flash gold plating nickle thickness  (um) 3-15

35

profile size tolerance (mm) ±0.08

36

Max. solder mask plugging hole size (mm) 0.7

37

BGA pad (mm) ≥0.25 (HAL or HAL Free:0.35)

38

V-CUT blade position tolerance (mm) +/-0.10

39

V-CUT position tolerance (mm) +/-0.10

40

Gold finger bevel angle tolerance (o) +/-5

41

Impedence tolerance (%) +/-5%

42

Warpage tolerance (%) 0.75%

43

Min. legend width  (mm) 0.1

44

Fire flame calss 94V-0

Special for Via in pad products

Resin plugged hole size (min.) (mm) 0.3
Resin plugged hole size (max.) (mm) 0.75
Resin plugged board thickness (min.) (mm) 0.5
Resin plugged board thickness (max.) (mm) 3.5
Resin plugged maximum aspect ratio 8:1
Resin plugged minimum hole to hole space (mm) 0.4
Can difference hole size in one board? yes

Back plane board

Item
Max. pnl size (finished) (mm) 580*880
Max. working panel size (mm) 914 × 620
Max. board thickness (mm) 12
Max. layer-up(L) 60
Aspect 30:1 (Min. hole: 0.4 mm)
Line wide/space (mm) 0.075/ 0.075
Back drill capability Yes
Tolerance of back drill (mm) ±0.05
Tolerance of  press fit holes (mm) ±0.05
Surface treatment type OSP, sterling silver, ENIG

Rigid-flex board

Hole size (mm) 0.2
Dielectrical thickness (mm) 0.025
Working Panel size (mm) 350 x 500
Line wide/space (mm) 0.075/ 0.075
Stiffener Yes
Flex board layers (L) 8 (4plys of flex board)
Rigid board layers (L) ≥14
Surface treatment All
Flex board in mid or outer layer Both

Special for HDI products

Laser drilling hole size (mm)

0.075

Max. dielectric thickness (mm)

0.15

Min. dielectric thickness (mm)

0.05

Max. aspect

1.5:1

Bottom Pad size (under micro-via) (mm)

Hole size+0.15

Top side Pad size ( on micro-via) (mm)

Hole size+0.15

Copper filling or not (yes or no) (mm)

yes

Via in Pad design or not ( yes or no)

yes

Buried hole resin plugged (yes or no)

yes

Min. via size can be copper filled (mm)

0.1

Max. stack times

any layer

Product detail pictures:

Manufacturer for Custom Pcb - EMS solutions for Printed Circuit Board – Mineiwing detail pictures

Manufacturer for Custom Pcb - EMS solutions for Printed Circuit Board – Mineiwing detail pictures

Manufacturer for Custom Pcb - EMS solutions for Printed Circuit Board – Mineiwing detail pictures

Manufacturer for Custom Pcb - EMS solutions for Printed Circuit Board – Mineiwing detail pictures

Manufacturer for Custom Pcb - EMS solutions for Printed Circuit Board – Mineiwing detail pictures


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Our target is always to satisfy our customers by offering golden support, superior value and high quality for Manufacturer for Custom Pcb - EMS solutions for Printed Circuit Board – Mineiwing , The product will supply to all over the world, such as: Thailand, Chile, Slovak Republic, By adhering to the principle of "human oriented, winning by quality", our company sincerely welcomes merchants from at home and abroad to visit us, talk business with us and jointly create a brilliant future.
  • The sales person is professional and responsible, warm and polite, we had a pleasant conversation and no language barriers on communication.
    5 Stars By jari dedenroth from Slovakia - 2017.12.31 14:53
    The factory technical staff not only have high level of technology, their English level is also very good, this is a great help to technology communication.
    5 Stars By Diego from Washington - 2018.06.05 13:10